Effusion cells (Evaporators, “K-cells”)

Effusion Cells are used in ultra-high vacuum (UHV) evaporation systems, for example in MBE (Molecular Beam Epitaxy) to generate ultrapure molecular and atomic beams from a large variety of elements and compounds. They are sometimes known as K-Cells or Knudsen Cells. In the product table you can see a range of different cells we can offer to evaporate almost every material. Temperatures range from: -60 °C to 2400 °C

Key Features


  • Cells can be supplied with a range of crucible materials depending on the material being deposited. The material must be chosen carefully keeping in mind the temperature required for evaporation, the relative coefficients of thermal expansion of the material to be evaporated compared to the crucible, and the required material capacity. Available crucible materials included include:
    • Pyrolytic Boron Nitride (PBN)
    • Pyrolytic Graphite (PGR)
    • Tantalum (Ta)
    • Molybdenum (Mo)
    • Tungsten (W)
    • Alumina (Al2O3)
    • Vitreous carbon (VC)
    • Quartz (SiO2)
    • Stainless steel
  • crucibles range in capacity from 0.5-150cc. Maximum crucible size is limited by the flange size, requirement for water cooling and type of heater
  • Options include:
    • Water cooling (may not be needed in an MBE system with an integrated cryopanel
    • Shutter (manual, motorised, pneumatic, rotary, flip, integrated separate)
    • Special crucibles for face down operation to prevent material loss
    • Multi cells with more than one crucible/heater on a single flange

Please click the download arrows in the table to access specific data sheets for each type of cell. Alternatively an overview datasheet is also available.

Our evaporation guide contains very useful information on the vapour pressure vs. temperature, melting point and suitable crucible materials for many elements in the periodic table.

Part No.Cell NameMax Temp (ºC)Min Temp. (ºC)Heater typeMax power (W)Available DN##CF flangesMin UHV length (mm)Special features/applications
CT-OLEDOLED80030wire filament (radiative)6040,63,100,160180Organics
CT-OLED+
CT-LTCLow Temperature (LTC)120050wire filament (radiative)22040,63,100180high vapour pressure
CT-LTC+
CT-LTCHLLow Temperature Hot Lip (LTC-HL)120050wire filament (radiative)22040,63,100180Hot lip
CT-LTCHL+
CT-SFCSingle Filament (SFC)140050wire filament (radiative)36040,63,100,160180medium vapour pressure
CT-SFC+
CT-HTC1700High Temperature 1700 (HTC)1700100wire filament (radiative)60040,63,100,160180Low vapour pressure
CT-HTC1700+
CT-HTC2000High Temperature 2000 (HTC)2000100wire filament (radiative)80040,63,100,160180Low vapour pressure
CT-HTC2000+
CT-TUBOTUBO2100200Resistive cylinder110040,63,100250Tubular filament (uniformity)
CT-TUBO+
CT-TUBOeTUBO-e2400200Resistive cylinder + e-beam170040,63,100250e-beam booster
CT-TUBOe+
CT-DFCDual Filament (DFC)140050dual zone wire filament360/120 2 zones40,63,100,160180Dual zone heater
CT-DFC+
CT-CLCCold Lip (CLC)140050cold lip 1 zone wire filament22040,63,100,160180Cold Lip (Aluminium)
CT-CLC+
CT-CRCCracker (CRC)1000100dual zone wire filament115/100 2 zone40,63,100,160150Cracking crucible insert
CT-CRC+
CT-VCRCValved Cracker (VCRC)800100dual zone wire filament40040,63,100,160250Valve
CT-VCRC+
CT-DECOPDecomposition (DECO-P)800150wire filament (radiative)36040,63,100,160180GaP>P2 decomp.
CT-DECOP+
CT-DECOASDecomposition (DECO-As)800150wire filament (radiative)36040,63,100,160180GaAs>As2 decomp.
CT-DECOAS+
CT-LECLinear (L-EC)1400200wire filament (radiative)1500Internal mountRoll-to-roll
CT-LEC+
CT-ULTCUltra Low (ULTC)30-60wire filament and cooling coil5040,63,100,160Nitrogen cooling. Cs, Hg I
CT-ULTC+
CT-HLCAtomic Hydrogen (HLC)2300200wire filament (radiative)28040,63180Surface cleaning atomic H
CT-HLC+
CT-HLCTAtomic Hydrogen (HLC-T)2800200Resistive cylinder35040,63180Surface cleaning atomic H
CT-HLCT+